Odisha Gets India’s First 3D Chip Packaging Unit
Odisha has made a giant stride in the semiconductor leg of India by laying the foundation stone of the country’s first futuristic 3D chip packaging unit at Info Valley, Bhubaneswar. The project being set up by 3D Glass Solutions through its Indian arm, Heterogeneous Integration Packaging Solutions Pvt. Ltd., will boost the country‘s semiconductor ecosystem. … Read more